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转述 商业模式与融资·

Says AI's next bottleneck may be money, not chips or power

但博通(AVGO)首席执行官陈福阳认为,下一个主要制约因素可能是资金。

English original

But Broadcom (AVGO) CEO Hock Tan believes the next major constraint could be money.

2026年10月在星展银行活动上发言

H
陈福阳Broadcom · 首席执行官

报道摘要

Chips, memory, and power have been at the center of debates over AI infrastructure bottlenecks. But Broadcom (AVGO) CEO Hock Tan believes the next major constraint could be money. Speaking at the DBS ...

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